Process Integration Engineer TSV

ams OSRAM

PI (process integration) representative for TSV (Through-Silicon-Via) technology
Supervise and monitor manufacturing of the process technology in close teamwork with single process engineering, process R&D, QA, etc.
Maintain process deliveries (e.g. FMEA, PCP, etc.) and lead cross-functional discussions
Optimize processes and solve process problems in close teamwork with different departments (e.g. Test, Product Engineering, Design, Design Support, QA, etc.)
Evaluate and implement possible process simplifications/improvements in order to lower manufacturing costs and increase process and product robustness

Master degree or PhD in Physics, Chemistry or Material Sciences
High organizational and communication skills
Ability to work independently and self-consciously
Advanced problem solving skills (beneficial: Six Sigma experience, etc.)
Ability to lead cross-functional teams and willingness to work in a team environment
Ability to adjust to fast changing environments and project working style to set up new processes
Confident writing and speaking ability in English
Beneficial: experience and mind-set according automotive standards in semiconductor industry
Beneficial: experience in technical issue solving in 8D format

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