As a member of the Mixed Signal Design team, you will be a key member of a small, dynamic IC Design group that develops high speed (>25Gb/s), and high accuracy, analog designs for optical communications products. You will architect, design, layout, measure and productize ultra-deep sub-micron-based CMOS products.
You will lead efforts for a large block on a complex chip, mentor team members and track deliverables, participate in peer review of complex IC designs and provide solid design methodology from conception to production.
You will also collaborate with packaging and hardware design team to ensure signal and power integrity specifications are met.
You are enthusiastic about developing high speed AMS circuits and best-in-class products that push the boundaries of what is possible. You are detail oriented, high energy and the drive to get things done and solve difficult problems.
You are capable to figure things out by yourself, but you also participate in our friendly and team-oriented collaboration approach, which means you enjoy learning from your colleagues and letting them learn from you.
You are not shy to always point out how we can be more effective as a team, and you are open to similar suggestions by your team members.
Your great personal and communication skills allow effortless collaboration within and across teams and to steer the development in a positive direction.
United Kingdom Electrical Engineer Electronic Engineer Cisco Systems