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Development Engineer Electronics Packaging

Airbus Group

Friedrichshafen, Germany

Description of the job

A vacancy for a Development Engineer Electronics Packaging (m/f) has arisen within Airbus Defence & Space in Friedrichshafen. The successful applicant will join “Electronics Packaging”.

Tasks & accountabilities

Your main tasks and responsibilities will include:

  • Managing all the documentation relative to mechanical & thermal engineering with customers during the various reviews you will be involved in
  • Assessing and providing justification about the mechanical & thermal behaviour of the units
  • During the proposal phase, establishing the detailed definition and budget of all packaging activities needed to fulfil project needs
  • During the project execution phase, as a member of the Product Core team:
    • ensuring the management of the packaging activities, fulfilling the planned budget and schedule
    • coordinating all technical activities related to packaging design, EEE assembly qualification and DFM
  • From the specifications, establishing the equipment physical designs
    • Defining the mechanical and thermal designs for the electronic boards, i.e. board mechanical frame design and PCB built-up consolidation for thermal aspects
    • Defining the unit mechanical and thermal packaging, taking into account Design for Manufacturing rules, in particular setting up trade-offs to select optimal technical solution vs performances and production criteria
    • Selecting innovative technologies to optimise the performances, design and manufacturability of the unit
  • Managing the technical activities related to the introduction of EEE parts (assembly) in the electronic design
  • Preparing the unit mechanical assembly tools and procedures with support of Production Methods, Design Office and Quality teams in order to ensure the optimised production cost
  • Defining and validating the mechanical and thermal designs of the packaging, supported by mathematical analyses (structure and thermal) provided by the Design Office:
    • Reporting the mechanical and thermal analyses at the board and equipment levels,
    • Producing detailed definitions and drawings of mechanical parts,
    • Producing the electrical analysis report (i.e. double insulation analysis, EMC analysis, etc.),
    • Reviewing the PCB detailed definition,
  • Preparing and supporting the Test and Validation team for equipment qualification and acceptance tests (mechanical and thermal)
  • Preparing reports summarising the environmental tests and validating the simulations
  • Supporting the Project Manager to prepare and execute internal and external reviews throughout the product development cycle
  • After the Qualification Review, supporting the Core Team for any actions connected with Packaging

Required skills

We are looking for candidates with the following skills and experience:

  • Educated to a Master's degree level (or equivalent) in Mechanical, Thermal Engineering or equivalent
  • Extensive experience in Manufacturing Engineering
  • Experience in Mechanical and Thermal Architecture
  • Skills in Catia and Mentor would be a plus
  • Knowledge in Femap would be a plus
  • Skills in Nastran would be plus
  • Very good communication skills, Team Player, analytical skills and the ability to summarise
  • Negotiation level of English; advanced skills in German

For more details and to apply for this job click here

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